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Applicable for the packaged IC marking of DIP, QFN and BGA.


  • Fully-automatic loading and unloading from hanging basket to hanging basket, stable laser output, direction inspection function of intelligent vision system, sampling inspection function of marking effect
  • Friendly HMI
  • Imported double-head 20W fiber laser marking system; the green laser, UV laser, CO2 laser and other laser sources are optional
  • With special fume removal device, it can quickly extract the fume and dust produced during marking to protect the marking area environment
  • It complies with CE MARK and SEMI standard


Machine model HDZ-SIC100 HDZ-SIC200
Marking scope 320mm*160mm 320mm*160mm
Product specification L: 160-320mm; W: 30-80mm L: 160-320mm; W: 30-80mm
Font TFT and SHX; with font library module modification program
Final processing repeated positioning precision ±0.1mm ±0.1mm
UPH 1200 pieces/h (idle) 1200 pieces/h (idle)
Power supply AC 220V, 50/60Hz AC 220V, 50/60Hz
Air source 0.6-0.8 MPa 0.6-0.8 MPa
Overall dimension 2525mm*1665mm*2000mm 2515mm*1420mm*2000mm

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