Features

With the green laser or UV laser, the focusing spot is fine, and it is non-contact marking.
Fully-automatic loading and unloading, automatic edge searching, simple operation and high efficiency.
The whole system adopts computer control, Windows operation platform，interface in English, self-developed software, easy to operate.
With high automation, it has the function of automatic fault alarm.
Precise marking to the product DIE.

Specification

Machine model	HDZ-WAF500	HDZ-WAF600
Laser type	Fiber laser, CO2 (optional)	UV, green light (optional)
Laser power (customized according to the customer’s actual marking need)	Fiber 20W、CO2 10W	UV 7W, green light 10W
Cooling mode	Air cooling	Water cooling
Final processing repeated positioning precision	±0.2mm	±0.05mm
Processing product type	2 inch, 4 inch, 6 inch wafer	6 inch, 8 inch, 12 inch wafer
Power supply	220V, 50Hz	220V, 50Hz
Overall dimension (for reference)	900mm1150mm1700mm	1950mm1650mm1635mm