Applicable for the 6-inch, 8-inch and 12-inch wafer marking.


  • With the green laser or UV laser, the focusing spot is fine, and it is non-contact marking.
  • Fully-automatic loading and unloading, automatic edge searching, simple operation and high efficiency.
  • The whole system adopts computer control, Windows operation platform,interface in English, self-developed software, easy to operate.
  • With high automation, it has the function of automatic fault alarm.
  • Precise marking to the product DIE.



Machine model HDZ-WAF500 HDZ-WAF600
Laser type Fiber laser, CO2  (optional) UV, green light (optional)
Laser power (customized according to the customer’s actual marking need) Fiber 20W、CO2 10W UV 7W, green light 10W
Cooling mode Air cooling Water cooling
Final processing repeated positioning precision ±0.2mm ±0.05mm
Processing product type 2 inch, 4 inch, 6 inch wafer 6 inch, 8 inch, 12 inch wafer
Power supply 220V, 50Hz 220V, 50Hz
Overall dimension (for reference) 900mm*1150mm*1700mm 1950mm*1650mm*1635mm

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